BrainChip and MYWAI partner to deliver next-generation edge AI Solutions

Partnerships
Enablence Technologies and Polar Semiconductor sign strategic agreement to develop and manufacture Optical Chips
The strategic partnership enhances production capabilities, and access to cutting-edge technologies, and accelerates the release of advanced optical products. Read More>>
BrainChip and MYWAI partner to deliver next-generation edge AI Solutions
The partnership targets industrial and robotic sectors, enhancing AI deployment for efficiency, performance, and security. Read More>>
OnePlus and Qualcomm collaborate to feature Oneplus 12 with Snapdragon 8 Gen 3 chipset
The collaboration focuses on CPU optimization, gaming experience, AI performance, and camera enhancements for flagship performance.  Read More>>

Deal
Spectra7 receives first order to produce GC1122 chips for Chinese company
The chips offer cost, size, and energy consumption savings for advanced implementations like AI. The chips, operating at speeds up to 800 Gbps and 1.6 Tbps, offer cost-efficient, compact, and energy-saving solutions for data centers. Read More>>

Centre Setup and Expansion
Simmtech to set up US$ 150 Mn Semiconductor Plant in Sanand, Gujarat
The move aligns with Gujarat’s ambition to manufacture India’s first indigenous semiconductor chip by 2024. Read More>>
Ferrotec’s new facility in Kulim opens for production
Ferrotec’s new RM850 million manufacturing facility in Kulim Hi-Tech Park, Kedah, opens to meet the growing demand for its semiconductor products in the dynamic Asian market. The plant aims to become a global semiconductor industry supplier. Read More>>

Merger and Acquisition
Japan’s Renesas to buy U.S. chip firm Transphorm for US$339 Mn
The move aims to strengthen Renesas’ product lineup for the auto, energy, and computing sectors, leveraging Transphorm’s gallium nitride technology. Read More>>

Executive Movement
UK tech firm IQE appoints Jutta Meier as CFO
Meier, who previously he was worked as a senior finance director at Intel Corp. brings experience in supporting Intel’s foundry business transformation. Read More>>

New Product Development and Product Launch
Frore launches a lightweight, self-cleaning cooling chip
Frore Systems introduces AirJet Mini Slim, adhering to Frore’s Law by maintaining cooling performance while reducing thickness to 2.5mm. The chip’s self-cleaning feature and thermal sensor enhance semiconductor cooling efficiency. Read More>>
Qualcomm announces Samsung and Google plan to use its new headset chips
Qualcomm unveils Snapdragon XR2+ Gen 2, a cutting-edge chipset, set to power Samsung and Google’s mixed reality and virtual reality headsets. The cutting-edge chipset, capable of processing data from 12 onboard cameras, positions the tech giants for advancements in immersive experiences. Read More>>
Alif Semiconductor delivers advanced on-chip security solutions for its Ensemble family
It features a unique security architecture with a dedicated Secure Enclave and, a secure firewall structure. The solution enhances security for Edge devices powered by advanced processing, including AI/ML, ensuring secure key management, attestation, and lifecycle management. Read More>>

• GLOBALFOUNDRIES Inc. has directed its efforts towards expediting the production of next-generation GaN (gallium nitride) chips. This strategic focus aims to propel GLOBALFOUNDRIES Inc. toward achieving large-scale production of GaN chips, critical for diverse applications including 5G and 6G cellular technology, automotive systems, industrial Internet of Things (IoT) devices, and essential infrastructure such as power grids. 
• GLOBALFOUNDRIES Inc. has announced significant advancements to its industry-leading 22FDX® (22nm FD-SOI) platform, introducing various innovative features and enhancements. 
• GLOBALFOUNDRIES Inc. focuses on the production of the SST ESF3 third-generation embedded SuperFlash non-volatile memory (NVM) solution in the GF 28SLPe foundry process. This collaboration has set a new industry benchmark for implementing SST’s widely deployed ESF3 SuperFlash technology. 
• GLOBALFOUNDRIES Inc. has introduced advancements in the industry’s first RFSOI foundry solution manufactured on 300mm wafers. GF’s 9SW technology provides a low-cost, low-power, and highly flexible solution for RF Front End Applications. It enhances the 8SW with superior switching, low-noise amplifiers (LNA), and logic processing capabilities. 
• GLOBALFOUNDRIES Inc. has introduced new solutions to meet the demand for enhanced power performance, efficiency, safety, and connectivity in automotive applications.

Braindesk Report Link

Key Funding Alert

Here’s what’s new on our Sales Intelligence Platform
New Buyers Search Experience

• Try the beta Buyers search experience with advanced filtering and visualization capabilities.