Qualcomm claims its new chips are 21% faster than Apple’s M3

Partnerships
Arizona State University and NXP Semiconductors partners to boost manufacturing packaging in Arizona
They have entered a partnership with a $17.5 million investment to advance fan-out wafer-level packaging research. The collaboration will strengthen the Arizona semiconductor industry by focusing on GaN manufacturing, 6G technology, IoT, and machine learning. Read More>>
Japan collaborates with Nvidia to boost Semiconductor Industry
The collaboration aims to build new factories, showcasing Japan’s determination to regain a competitive edge in global chip manufacturing and leverage AI growth potential. Read More>>
Breakthrough Digital Lithography Technology: A Game-Changer for AI and Computing Systems
Applied Materials and Ushio partners to develop a digital lithography system for advanced substrates, addressing substrate warpage issues, and revolutionizing the semiconductor industry with superior computational capabilities. Read More>>

Deals
ASML and Samsung ink chip deal as Yoon visits Netherlands
ASML and Samsung signed a US$ 772.9 Mn deal to build a semiconductor research plant in South Korea, aiming to strengthen the semiconductor sector through a chip alliance and advance technology in manufacturing chips for various devices. Read More>>
GlobalFoundries awarded a 10-year US Department of Defense contract to build semiconductors
The contract aims to supply semiconductors and provide access to semiconductor technologies and full-scale manufacturing for the Department of Defense and its contractors. Read More>>

Centre Setup and Expansion
Asahi Kasei to build US$ 105 Mn chip material plant in Central Japan
It’s aiming to double its capacity for liquid photosensitive resin used in semiconductor production. The goal is to double the production of liquid photosensitive resin used to protect chip surfaces, in response to the increasing demand for advanced chips. Read More>>
Intel sets up an R&D Lab at CtrlS datacenters for chip design
Intel establishes an R&D lab for chip design at CtrlS Datacenters in Bangalore, enhancing global advanced data center development. The facility focuses on developing new microprocessor architectures for high-quality and reliable computing systems. Read More>>

Mergers and Acquisitions
Toshiba sees power chips as immediate growth driver after US$ 14 Bn buyout
The aim is to expand power chip production and catch up with industry leaders like Infineon Technologies AG. The acquisition is driven by the growing demand for electric vehicles and the immediate profit potential of power management chips. Read More>>
New Product Development and Product Launch
Qualcomm claims its new chips are 21% faster than Apple’s M3
Qualcomm has launched its new Snapdragon X Elite PC chip claiming it outperforms Apple’s latest silicon. The aim is to provide high-performance, energy-efficient hardware for Snapdragon-powered PCs, offering a competitive alternative to Apple and Intel chips in terms of CPU performance and AI capabilities. Read More>>

Advanced Solutions and Platforms

• GLOBALFOUNDRIES Inc. has directed its efforts towards expediting the production of next-generation GaN (gallium nitride) chips. This strategic focus aims to propel GLOBALFOUNDRIES Inc. toward achieving large-scale production of GaN chips, critical for diverse applications including 5G and 6G cellular technology, automotive systems, industrial Internet of Things (IoT) devices, and essential infrastructure such as power grids. 
• GLOBALFOUNDRIES Inc. has announced significant advancements to its industry-leading 22FDX® (22nm FD-SOI) platform, introducing various innovative features and enhancements.
• GLOBALFOUNDRIES Inc. focuses on the production of the SST ESF3 third-generation embedded SuperFlash non-volatile memory (NVM) solution in the GF 28SLPe foundry process. This collaboration has set a new industry benchmark for implementing SST’s widely deployed ESF3 SuperFlash technology.
• GLOBALFOUNDRIES Inc. has introduced advancements in the industry’s first RFSOI foundry solution manufactured on 300mm wafers. GF’s 9SW technology provides a low-cost, low-power, and highly flexible solution for RF Front End Applications. It enhances the 8SW with superior switching, low-noise amplifiers (LNA), and logic processing capabilities.
• GLOBALFOUNDRIES Inc. has introduced new solutions to meet the demand for enhanced power performance, efficiency, safety, and connectivity in automotive applications.

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